Ключевые слова: HTS, REBCO, tapes, critical current, degradation studies, mechanical properties, strain effects, crack formation, fracture behavior, shunt, modeling, numerical analysis
Ключевые слова: HTS, YBCO, coated conductors, design parameters, tapes, mechanical properties, delamination, interfaces, crack formation, shear strength, experimental results
Ключевые слова: HTS, EuBCO, GdBCO, bulk, single grain, microstructure, melting, fabrication, X-ray diffraction, microstructure, doping, crack formation, porosity
Ключевые слова: HTS, bulk, cylinders, crack formation, mechanical properties, thermal stress, stress effects, pulsed magnetization, numerical analysis
Ключевые слова: HTS, Bi2223/Ag, tapes, fabrication, PIT process, nanodoping, nanoscaled effects, mechanical treatment, sintering, mechanical properties, crack formation, microstructure, X-ray diffraction, critical current density, temperature dependence, magnetic field dependence, experimental results
Ключевые слова: LTS, Nb3Sn, wires, RRP process, fabrication, deformation, impregnation, crack formation, X-ray tomography, measurement technique, neural networks
Bottura L., Scheuerlein C., Devred A., Savary F., Lee P.J., Balachandran S., Wolf F., Cooper J., Oss O.B.
Ключевые слова: LHC, luminosity, coils, magnets dipole, LTS, Nb3Sn, cables, filaments, crack formation, microstructure, experimental results
Ключевые слова: fracture behavior, crack formation, magnetic field dependence, current density, modeling, numerical analysis
Ключевые слова: HTS, Bi2212, bulk, crack formation, annealing process, mechanical properties, hardness, loads, experimental results
Ключевые слова: HTS, films, shielding current density, crack formation, modeling computational
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