Ключевые слова: undulator, design, HTS, REBCO, bulk, disks, thickness dependence, trapped field, modeling, numerical analysis
Ключевые слова: HTS, GdBCO, YBCO, coated conductors, stabilizing layers, thickness dependence, conduction cooled systems, critical characteristics, critical current, temperature dependence, normal zone propagation, quench energy, quench protection, hot spots, critical current density, experimental results
Ключевые слова: HTS, REBCO, coated conductors, Cu-based conductors, tapes, thickness dependence, stacked blocks, strands, mechanical properties, twist-pitch, bending radius, design parameters, magnetic field dependence, critical characteristics, critical current density, current-voltage characteristics, experimental results
Varela M., Arenholz E., Liu K., Takamura Y., Murray P.D., Gilbert D.A., Grutter A.J., Kirby B.J., Hernandez-Maldonado D., Brubaker Z.E., Liyanage W.L., Chopdekar R.V., Taufour V., Zieve R.J., Jeffries J.R., Borchers J.A.
Laan D.C., Knoll A., Carota G., Hazelton D., Jaroszynski J., Abraimov D., Weiss J.D., Francis A., Bradford G., Small M.A.
Ключевые слова: thermal stability, stabilizing layers, Cu-based conductors, resistance, thickness dependence, overcurrent, critical characteristics, current-voltage characteristics, time evolution, ac performance, current waveforms, voltage waveforms, transient performance, experimental results, HTS, GdBCO, coated conductors
Holzapfel B., Hanisch J., Nast R., Driessche I.V., Erbe M., Cayado P., Rijckaert H., Buysser K.D., Sierra J.D., Dominguez P.L.
Ключевые слова: chemical solution deposition, inkjet printing, HTS, YBCO, nanocomposites, substrate LaAlO3, films thin, nanodoping, critical characteristics, critical current density, thickness dependence, X-ray diffraction, microstructure, angular dependence, Jc/B curves, magnetic field dependence, pinning force, fabrication, experimental results
Ключевые слова: HTS, REBCO, coated conductors, substrate stainless steel, stabilizing layers, thickness dependence, cables current limiting, design, design parameters, impedance, temperature rise, resistance, temperature dependence, critical characteristics, current-voltage characteristics, fault currents, length, modeling, numerical analysis
Gomory F., Vojenciak M., Skarba M., Pekarcikova M., Drienovsky M., Cuninkova E., Mosat M., Buran M., Misнk J., Krajcovic J., Hulan T.
Ключевые слова: MgB2/Ta/Cu/, wires, barriers, interfaces, thickness dependence, current transfer, geometry effects, modeling, numerical analysis
© Copyright 2006-2012. Использование материалов сайта возможно только с обязательной ссылкой на сайт.
Свои замечания и пожелания вы можете направлять по адресу perst@isssph.kiae.ru
Техническая поддержка Alexey, дизайн Teodor.