Ключевые слова: HTS, REBCO, MOCVD process, high rate process, nucleation, substrate Hastelloy, IBAD process, coated conductors, films epitaxial, grain size, microstructure
Holzapfel B., Hanisch J., Schultz L., Huhne R., Matias V., Iida K., Haindl S., Kidszun M., Engelmann J., Trommler S., Kurth F., Pozo I.L.
Ключевые слова: HTS, YBCO, REBCO, magnets, substrate Hastelloy, YBCO, coated conductors, mechanical properties, tensile tests, stress effects, strain effects, coils pancake, critical current, critical caracteristics, angular dependence, LTS, Nb3Sn, magnetic properties, irreversibility fields, critical current density, magnetic field dependence, temperature dependence, presentation
Ключевые слова: presentation, HTS, YBCO, coated conductors, IBAD process, MOCVD process, commercialization, long conductors, fabrication, roughness, planarization, texture, substrate Hastelloy, microstructure, irradiation effects, growth rate, defects, pinning, critical caracteristics, critical current density, angular dependence, Jc/B curves, nanoscaled effects, nanodots, phase composition, defects columnar, homogeneity, critical current, thickness dependence
Iijima Y., Saitoh T., Kakimoto K., Sutoh Y., Igarashi M., Hanyu S., Hanada Y., Kutami H., Hayashida T., Tashita C., Morita K.
Matias V., Maiorov B., Moeckly B., Coulter Y., Sheehan C., Yung C., Glyantsev V., Ruby W., Huh J., Turner P.
Ключевые слова: presentation, HTS, YBCO, coated conductors, IBAD process, solution techniques, planarization, long conductors, co-evaporation process, critical caracteristics, critical current, critical current density, n-value, Jc/B curves, angular dependence, pinning, substrate Hastelloy, fabrication
Ключевые слова: magnets, cryocoolers, hybrid systems, LTS, Nb3Sn, NbTi, HTS, YBCO, coated conductors, substrate Hastelloy
Higashikawa K., Awaji S., Watanabe K., Kiss T., Izumi T., Inoue M., Yamada Y., Ibi A., Fukushima H., Fuger R., Namba M.
Iijima Y., Saitoh T., Kakimoto K., Sutoh Y., Fujita S., Igarashi M., Hanyu S., Hanada Y., Kutami H., Hayashida T., Tashita C., Morita K., Nakamura N.
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